Scaling to 200mm SiC: Why High-Purity Coatings are the 2026 Benchmark for Power Electronics
As the semiconductor industry shifts toward 200mm (8-inch) SiC wafer production, thermal management at 1600°C has become a critical bottleneck. This article explores how advanced CVD TaC coatings and 3D C/C composites—backed by research from institutions like Fraunhofer IISB and imec—are redefining durability and wafer yield in 2026.
